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UEI30 Series
30W Isolated Wide-Range DC-DC Converters
Mean Time Before Failure (MTBF) Table
These ?gures use a standard MTBF probability calculation as an indication of component parts stress and life derating. The calculaton is based on separate MTBF
values for all internal parts in addition to stated environmental conditions. Two MTBF values are presented. The Telcordia method is widely used in industry, partic-
ularly telecom. The United States MIL-HDBK method is for military and industrial applications. Please refer to a quali?ed reliability engineer for more background.
Model Number
UEI30-033-Q12N-C
UEI30-033-Q12N-C
UEI30-033-Q12P-C
UEI30-033-Q12P-C
MTBF (Hours)
2,676,902
2,123,124
2,733,781
2,142,206
Method [1,2]
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
UEI30-033-Q48N-C
UEI30-033-Q48N-C
UEI30-033-Q48P-C
UEI30-033-Q48P-C
UEI30-050-Q12N-C
UEI30-050-Q12N-C
UEI30-050-Q12P-C
UEI30-050-Q12P-C
UEI30-120-Q48N-C
UEI30-120-Q48N-C
UEI30-120-Q48P-C
UEI30-120-Q48P-C
UEI30-150-Q48N-C
UEI30-150-Q48N-C
UEI30-150-Q48P-C
UEI30-150-Q48P-C
3,416,592
3,172,548
3,427,027
3,193,652
2,531,509
2,207,508
2,554,127
2,229,031
3,072,461
2,510,927
2,900,319
2,495,846
2,833,366
2,408,836
2,776,615
2,421,938
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Telcordia
MIL-HDBK
Notes:
[1] Mean Time Before Failure is calculated using the Telcordia (Belcore) SR-332 Method
1, Case 3, ISSUE 2, ground ?xed controlled conditions, Tambient=+25°C, full output load,
natural air convection.
[2] Mean Time Before Failure is calculated using MIL-HDBK-217FN2, GB ground benign,
Tambient=+25°C, full output load, natural air convection.
Soldering Guidelines
Murata Power Solutions recommends the speci?cations below when installing these converters. These speci?cations vary depending on the solder type. Exceeding these speci?ca-
tions may cause damage to the product. Your production environment may differ; therefore please thoroughly review these guidelines with your process engineers.
Wave Solder Operations for through-hole mounted products (THMT)
For Sn/Ag/Cu based solders:
For Sn/Pb based solders:
Maximum Preheat Temperature
Maximum Pot Temperature
Maximum Solder Dwell Time
115° C.
270° C.
7 seconds
Maximum Preheat Temperature
Maximum Pot Temperature
Maximum Solder Dwell Time
105° C.
250° C.
6 seconds
Murata Power Solutions, Inc.
11 Cabot Boulevard, Mans?eld, MA 02048-1151 U.S.A.
ISO 9001 and 14001 REGISTERED
This product is subject to the following operating requirements
and the Life and Safety Critical Application Sales Policy :
Refer to: http://www.murata-ps.com/requirements/
Murata Power Solutions, Inc. makes no representation that the use of its products in the circuits described herein, or the use of other
technical information contained herein, will not infringe upon existing or future patent rights. The descriptions contained herein do not imply
the granting of licenses to make, use, or sell equipment constructed in accordance therewith. Speci?cations are subject to change without
notice.
? 2013 Murata Power Solutions, Inc.
www.murata-ps.com/support
MDC_UEI Series 30W.B01 Page 18 of 18
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